60. Liu, Z., Pan, X., Ma, Q. & Fang, H. Receding Dynamics of Droplet Deposition on a Smooth Surface from a Central Jet to Secondary Droplet Emission. Langmuir 36, 15082–15093 (2020).
59. Chen, H., Nie, Q. & Fang, H. Dynamic behavior of droplets on confined porous substrates: A many-body dissipative particle dynamics study. Phys. Fluids 32, 102003 (2020).
58. Qianli Ma, Lili Zheng, Guojun Zhang, Chunli Shang, Haisheng Fang*, Numerical modeling of sintering and dehydroxylation of porous silica preform for low-hydroxyl silica glass fabrication, Ceramics International 46(1) (OCT 2020) 23067-23083.
57. Xin Deng, Qichun Nie, Yu Wu, Haisheng Fang, Peixin Zhang, Yangsu Xie*, Nitrogen-Doped Unusually Superwetting, Thermally Insulating, and Elastic Graphene Aerogel for Efficient Solar Steam Generation, ACS Appl. Mater. Interfaces 12(23) (JUN 2020) 26200-26212
56. Hao Chen, Qichun Nie, Haisheng Fang*, Many-body dissipative particle dynamics simulation of Newtonian and Non-Newtonian nanodroplets spreading upon flat and textured substrates, Applied Surface Science 519 (JUL 2020) 146250.
55. Hongya Zhang, Chengshuai Li, Runjie Zhang, Yixin Lin, Haisheng Fang*, Thermal analysis of a 6s4p Lithium-ion battery pack cooled by cold plates based on a multi-domain modeling framework, Applied Thermal Engineering 173 (JUN 2020) 115216
54. Zhongyi Liu, Siqi Li, Haisheng Fang*, Xiaolong Pan, Four Modes of Droplet Permeation through a Micro-pore with a T-Shaped Junction during Spreading, Transport in Porous Media 132(1) (MAR 2020) 219-240
53. Xuran Dong, Xiaolong Pan, Xianxian Gao, Haisheng Fang*, Theoretical Uniformity Analysis and Improvement of Spray Deposition by Mixing Nozzles with Heating Conditions, Coatings 10(1) (JAN 2020) 81
52. Qichun Nie, Yongan Huang, Zhouping Yin*, Haisheng Fang*, Large deformation of a conductive nanodroplet in a strong electric field, Physics of Fluids 32(2) (FEB 2020) 022006
51. Xuran Dong, Yonghong Zhong, Haisheng Fang*, The Effects of Heating Conditions on the Spray Uniformity of the Mixing Nozzle, Transactions On Electrical And Electronic Materials 21(2) (APR 2020) 208-216. (EI)